A tipster, with username @RODENT950, tweeted that Huawei’s next-gen chipset Kirin 9010 is based on 3nm process. There’s, however, no official confirmation to the reported details.
The details about the silicon comes at a time when Huawei is facing challenges in retaining its chipset business globally — due to US sanctions and shortage of supply. A recent report by Counterpoint showed that the Chinese company didn’t receive any growth in the last quarter and managed to retain its 12 percent share in the worldwide smartphone chipset market.
Last year, Huawei Consumer Business Group CEO Richard Yu indicated that the company would stop making flagship chips due to pressure over the restrictions imposed in the US. “This year may be the last generation of Huawei Kirin high-end chips,” Yu had said at an industry conference in August.
Having said that, the latest rumour around the HiSilicon Kirin 9010 SoC suggests that Huawei may have one last weapon to take on Qualcomm’s Snapdragon and Samsung’s Exynos chips. The move to 3nm process appears quite competitive and significant — considering the recent arrival of 5nm chips.
Gadgets 360 has reached out to Huawei for a comment on the development of Kirin 9010 SoC. This report will be updated when the company responds.
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